Design Center

Designing high-temperature electronics for auto apps
High-temperature semiconductor technologies can survive temperatures approaching 176 C, but careful design is required to deliver cost-effective devices achieving stable, predictable performance.

• Challenges in automotive radio design

• Copper-based piezo-actuators offer improved durability

• Case study: Quality foundation improves Delphi's time to market

• Getting a grip on FlexRay, Part 2: Automated analysis, validation of network topologies

• Verifying the border line between auto hardware, software

Learning Center

Most Recent Courses

• You've Got the Power: Toshiba's New UMOS-V MOSFET Family Boosts Power Efficiency
  Educast  10 Minutes
• Develop a Display System Using Low-Cost Cyclone III FPGAs
  Educast  10 min.
• S08 Controller Area Network (msCAN)
  Product course  80 min.
• Overview of the S08 Slave LIN Interface Controller (SLIC) Module
  Product course  75 min.
• An Introduction to the RS08 CPU
  Product course  30 min.
• An Introduction to HCS08 Serial Communication Interface (SCI)
  Product course  25 min.
• An Overview of HCS08 Parallel I/O and KBI
  Product course  35 min.

Product Center

Latest Product Articles

• Hall-effect sensor interface provides flexibility through analog, digital outputs
• Quartet of intelligent power devices focus on auto lighting applications
• Coax antenna connector system
• 2.5-A automotive gate drive optocoupler is ideal for hybrids
• 55 nanometer embedded flash process for automotive microcontrollers

Under the Hood

• Under the Hood: Intel's 45-nm high-k metal-gate process
• Under the Hood: XM radio receiver makes waves
• Under the Hood: Inside the Apple iPhone

Technical Paper Library

Latest Technical Papers

• AUTOSAR and FlexRay: A Tale of Two Standards
• The Atom-Powered Car
• Open Source Autos
• Taking wiring design to the next level
• Simulation Provides Key to Explosive Automotive Design Challenges
• Optocoupler Capabilities for Hybrid Electric Vehicle Electric Motor Inverter Applications
• Simulating automotive applications using standards

Featured Technical Papers

• Fujitsu and Visteon Work with Land Rover to Implement New State-of-the-Art "Virtual Image Cluster" for the 2010 Range Rover
  Fujitsu Microelectronics
• Low Power Intel Architecture Platform for In-vehicle Infotainment
  Intel
• Battery Stack Monitor Extends Life of Li-Ion Batteries in Hybrid Electric Vehicles
  Linear Technology

Webinars

Latest Webinars

• Automotive Electronics Reliability: A Software to Silicon Methodology
  Synopsys
• Detecting Five Distinct Motions with MEMS Inertial Sensors
  Analog Devices
• LED Driver Selection Methodology
  Linear Technology and Nu Horizons Electronics
• Optimizing Noise in the Sensor Signal Path (Part III)
  Analog Devices and Avnet Electronics Marketing
• Achieve greater productivity and ease of use with Targeted Design Platforms enabled by Virtex-6 and Spartan-6 FPGAs
  Xilinx
• Automotive Optocouplers: Your Reliable Isolation Solution for Applications in Hybrid Electric Vehicles
  Avago Technologies